In the field of electronic packaging, ceramic substrates, with their excellent electrical, thermal and mechanical properties, have become key materials that support the stable operation of electronic devices.

With the rapid development of electronic packaging industry, it is in urgent need of packaging substrate materials with stable quality and high reliability, among which alumina ceramic substrate performs well in the general application.However, the production process of alumina ceramic substrate still needs to be further improved and improved, and the requirements for the size of alumina ceramic substrate, dimensional accuracy and performance stability are getting higher and higher.